说明
Memory Tester配置
无配置OEM 型号描述
The ADVANTEST T5377 is a multi-functional test system designed for memory semiconductors, aimed at reducing testing costs for semiconductor manufacturers. It serves both front-end testing of DRAM semiconductors and back-end testing of flash memory semiconductors. With the capability to test up to 256 devices simultaneously, the T5377 significantly improves testing efficiency. The T5377 offers double the throughput capabilities of its predecessor, the T5371, resulting in higher production rates and decreased testing costs for customers. It optimizes its memory repair analytical structure to align with a user's memory repair algorithm, making it well-suited for semiconductor manufacturing facilities that utilize 300-millimeter wafers.文件
无文件
ADVANTEST
T5377
已验证
类别
Final Test
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
117845
晶圆尺寸：
12"/300mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ADVANTEST
T5377
类别
Final Test
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
117845
晶圆尺寸：
12"/300mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Memory Tester配置
无配置OEM 型号描述
The ADVANTEST T5377 is a multi-functional test system designed for memory semiconductors, aimed at reducing testing costs for semiconductor manufacturers. It serves both front-end testing of DRAM semiconductors and back-end testing of flash memory semiconductors. With the capability to test up to 256 devices simultaneously, the T5377 significantly improves testing efficiency. The T5377 offers double the throughput capabilities of its predecessor, the T5371, resulting in higher production rates and decreased testing costs for customers. It optimizes its memory repair analytical structure to align with a user's memory repair algorithm, making it well-suited for semiconductor manufacturing facilities that utilize 300-millimeter wafers.文件
无文件