说明
无说明配置
无配置OEM 型号描述
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control文件
无文件
类别
Flip Chip Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
130018
晶圆尺寸：
未知
年份：
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT
AMICRA NOVA PLUS
类别
Flip Chip Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
130018
晶圆尺寸：
未知
年份：
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control文件
无文件