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说明
Amicra Die-Bonder配置
无配置OEM 型号描述
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control文件
无文件
PREFERRED
SELLER
类别
Flip Chip Bonders
上次验证： 26 天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
124492
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
ASMPT
AMICRA NOVA PLUS
类别
Flip Chip Bonders
上次验证： 26 天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
124492
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Amicra Die-Bonder配置
无配置OEM 型号描述
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control文件
无文件