
说明
Amicra Die-Bonder配置
无配置OEM 型号描述
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control文件
无文件
PREFERRED
SELLER
类别
Flip Chip Bonders
上次验证: 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
124492
晶圆尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
ASMPT
AMICRA NOVA PLUS
类别
Flip Chip Bonders
上次验证: 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
124492
晶圆尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Amicra Die-Bonder配置
无配置OEM 型号描述
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control文件
无文件