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说明
无说明配置
DIFFOEM 型号描述
For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.文件
无文件
类别
Furnaces / Diffusion
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
107353
晶圆尺寸：
12"/300mm
年份：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
AVIZA / SVG / THERMCO
RVP-300plus
类别
Furnaces / Diffusion
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
107353
晶圆尺寸：
12"/300mm
年份：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
DIFFOEM 型号描述
For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.文件
无文件