说明
无说明配置
DIFFOEM 型号描述
For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.文件
无文件
类别
Furnaces / Diffusion
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
107409
晶圆尺寸：
12"/300mm
年份：
2005
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
AVIZA / SVG / THERMCO
RVP-300plus
类别
Furnaces / Diffusion
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
107409
晶圆尺寸：
12"/300mm
年份：
2005
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
DIFFOEM 型号描述
For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.文件
无文件