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AXCELIS GSD 200
  • AXCELIS GSD 200
  • AXCELIS GSD 200
  • AXCELIS GSD 200
说明
6" wafer, batch processing. Deploys Ar, AsH3, BF3 and PH3
配置
无配置
OEM 型号描述
The Eaton/Axcelis GSD 200 is a high current implanter that can handle wafers up to 8 inches in size and has a maximum energy of 180KeV. It is part of the GSD platform, which is known for being the longest manufactured and supported batch ion implanter in the industry. Ion implantation, the technology used by this machine, involves bombarding ionized species into the first atomic layers of a solid to introduce different species into a substrate. This process can change the chemical or tribological properties of the surface, such as hardness, wear resistance, resistance to chemical attack, and reduced friction. It can also improve the oxidation resistance of coatings by forming a dense Al2O3 scale. This technology is widely used in micro-electronics, optics, bio-materials, and doped semiconductor materials.
文件

无文件

类别
High Current

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

115980


晶圆尺寸:

6"/150mm


年份:

1995


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

AXCELIS

GSD 200

verified-listing-icon
已验证
类别
High Current
上次验证: 60 多天前
listing-photo-6342624ae2874973801c72f0f58bf17f-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

115980


晶圆尺寸:

6"/150mm


年份:

1995


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
6" wafer, batch processing. Deploys Ar, AsH3, BF3 and PH3
配置
无配置
OEM 型号描述
The Eaton/Axcelis GSD 200 is a high current implanter that can handle wafers up to 8 inches in size and has a maximum energy of 180KeV. It is part of the GSD platform, which is known for being the longest manufactured and supported batch ion implanter in the industry. Ion implantation, the technology used by this machine, involves bombarding ionized species into the first atomic layers of a solid to introduce different species into a substrate. This process can change the chemical or tribological properties of the surface, such as hardness, wear resistance, resistance to chemical attack, and reduced friction. It can also improve the oxidation resistance of coatings by forming a dense Al2O3 scale. This technology is widely used in micro-electronics, optics, bio-materials, and doped semiconductor materials.
文件

无文件