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ESI 9830
  • ESI 9830
说明
No missing parts and It include the HDD with the software also
配置
无配置
OEM 型号描述
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
文件

无文件

PREFERRED
 
SELLER
verified-listing-icon

已验证

类别
Laser

上次验证: 60 多天前

Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

Deinstalled


产品编号:

117593


晶圆尺寸:

未知


年份:

2004


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

ESI

9830

verified-listing-icon
已验证
类别
Laser
上次验证: 60 多天前
listing-photo-023b6742a37541ba9d2f1cacbab89e77-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1746/023b6742a37541ba9d2f1cacbab89e77/0b881c4743fe46e09d1e0d4c92712bc9_1_mw.png
Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

Deinstalled


产品编号:

117593


晶圆尺寸:

未知


年份:

2004


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
No missing parts and It include the HDD with the software also
配置
无配置
OEM 型号描述
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
文件

无文件