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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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ESI 9830
    说明
    无说明
    配置
    Minimum Spot Size (1/e2): 1.5μm Accuracy: .15μm Wavelength: 1.3μm – LightWave Laser rep rate: 50kHz Maximum cut velocity: 200mm/second
    OEM 型号描述
    The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
    文件

    无文件

    ESI

    9830

    verified-listing-icon

    已验证

    类别
    Laser

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    Deinstalled


    产品编号:

    105419


    晶圆尺寸:

    8"/200mm, 12"/300mm


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    ESI 9830

    ESI

    9830

    Laser
    年份: 2006状况: 二手
    上次验证60 多天前

    ESI

    9830

    verified-listing-icon
    已验证
    类别
    Laser
    上次验证: 60 多天前
    listing-photo-310127180a444de98a188938f71311eb-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    Deinstalled


    产品编号:

    105419


    晶圆尺寸:

    8"/200mm, 12"/300mm


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    Minimum Spot Size (1/e2): 1.5μm Accuracy: .15μm Wavelength: 1.3μm – LightWave Laser rep rate: 50kHz Maximum cut velocity: 200mm/second
    OEM 型号描述
    The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
    文件

    无文件

    类似上架物品
    查看全部
    ESI 9830

    ESI

    9830

    Laser年份: 2006状况: 二手上次验证:60 多天前
    ESI 9830

    ESI

    9830

    Laser年份: 0状况: 二手上次验证:60 多天前
    ESI 9830

    ESI

    9830

    Laser年份: 0状况: 二手上次验证:60 多天前