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ESI 9830
  • ESI 9830
  • ESI 9830
  • ESI 9830
  • ESI 9830
说明
Laser Repair Working condition
配置
1. IR wave length 1.34um 2. Repair rate 50~100 kHz (standard type is 30KHz) 3. Spot size 1.5~3.5um 4. Laser stability < 15% 5. 8" & 12" wafer load port 6. OCR (two side) Front and Back side 7. Support SECS/GEM capability 8. Laser head worked 9. Link inspection Function
OEM 型号描述
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
文件

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verified-listing-icon

已验证

类别
Laser

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

50348


晶圆尺寸:

未知


年份:

2006


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ESI

9830

verified-listing-icon
已验证
类别
Laser
上次验证: 60 多天前
listing-photo-665bef1173bf4603afafb2113a08a651-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1647/665bef1173bf4603afafb2113a08a651/50f0c3801a974e058d2e8bf08ea924cc_8fca1c2ac025489a8a165033e22f102d1105c_mw.jpeg
listing-photo-665bef1173bf4603afafb2113a08a651-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1647/665bef1173bf4603afafb2113a08a651/09b05c6363154500aa1f4eab5733a9e7_fb3660d497bb4d7ba9b74c4f4ca0fb021105c_mw.jpeg
listing-photo-665bef1173bf4603afafb2113a08a651-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1647/665bef1173bf4603afafb2113a08a651/fe90ca739db14be7910ec06be899a0e3_966c9787337e499389feb9e44d0070541105c_mw.jpeg
listing-photo-665bef1173bf4603afafb2113a08a651-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1647/665bef1173bf4603afafb2113a08a651/82b255311bf241509b74780fe2abe10a_a685da1dcb2545c6978076085cd3fa3d1105c_mw.jpeg
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

50348


晶圆尺寸:

未知


年份:

2006


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Laser Repair Working condition
配置
1. IR wave length 1.34um 2. Repair rate 50~100 kHz (standard type is 30KHz) 3. Spot size 1.5~3.5um 4. Laser stability < 15% 5. 8" & 12" wafer load port 6. OCR (two side) Front and Back side 7. Support SECS/GEM capability 8. Laser head worked 9. Link inspection Function
OEM 型号描述
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
文件

无文件