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说明
PC - Serial Board for four RS-232 Ports - Camera Cables (length: 1.5m each) - Cognex MVS8100 Frame Grabber Card - Camera Breakout Cable for MVS Frame Grabber Card - EPROM - Windows 2000 - Back-up hard drive will be made on site for customer to keep - This PC will match the existing configuration of your EVG 620 - Condition: new配置
无配置OEM 型号描述
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.文件
无文件
类别
Mask/Bond Aligners
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
76556
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG6200-Infinity
类别
Mask/Bond Aligners
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
76556
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
PC - Serial Board for four RS-232 Ports - Camera Cables (length: 1.5m each) - Cognex MVS8100 Frame Grabber Card - Camera Breakout Cable for MVS Frame Grabber Card - EPROM - Windows 2000 - Back-up hard drive will be made on site for customer to keep - This PC will match the existing configuration of your EVG 620 - Condition: new配置
无配置OEM 型号描述
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.文件
无文件