说明
无说明配置
Automated Mask Aligner Wafer Size: 8" Equipment Configuration: Wafer Configuration: 9" inch mask holder square, 8" wafer chuckDouble-sided/Backside Alignment Capability Manual Load Motorized illuminator 1000w lamp (joystick)- Manual XYZ stage (coarse and finePCadiustments-Includes:Lamp,MirrorandOptOEM 型号描述
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.文件
无文件
类别
Mask/Bond Aligners
上次验证： 9 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
120507
晶圆尺寸：
未知
年份：
2004
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG6200-Infinity
类别
Mask/Bond Aligners
上次验证： 9 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
120507
晶圆尺寸：
未知
年份：
2004
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Automated Mask Aligner Wafer Size: 8" Equipment Configuration: Wafer Configuration: 9" inch mask holder square, 8" wafer chuckDouble-sided/Backside Alignment Capability Manual Load Motorized illuminator 1000w lamp (joystick)- Manual XYZ stage (coarse and finePCadiustments-Includes:Lamp,MirrorandOptOEM 型号描述
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.文件
无文件