说明
Contact Aligner配置
无配置OEM 型号描述
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder文件
无文件
SUSS MicroTec / KARL SUSS
BA8
已验证
类别
Mask/Bond Aligners
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Idle
产品编号：
116406
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
BA8
类别
Mask/Bond Aligners
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Idle
产品编号：
116406
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Contact Aligner配置
无配置OEM 型号描述
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder文件
无文件