说明
无说明配置
无配置OEM 型号描述
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder文件
无文件
SUSS MicroTec / KARL SUSS
BA8
已验证
类别
Mask/Bond Aligners
上次验证： 12 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116415
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
BA8
类别
Mask/Bond Aligners
上次验证： 12 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116415
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder文件
无文件