跳至主要内容
Moov logo

Moov Icon
APPLIED MATERIALS (AMAT) / VARIAN VIISta 900-3D
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The Varian VIISta 900 3D system is the industry’s flagship medium-current ion implanter for high-volume manufacturing beyond the 2xnm node. Its beam-line architecture has been specially designed with the angle accuracy and beam shape control necessary for exact dopant placement and minimal within-wafer and wafer-to-wafer variability for applications in logic finFETs and 3D memory structures. These capabilities also benefit CMOS image sensor technology as well as the most advanced planar structures.
    文件

    无文件

    verified-listing-icon

    已验证

    类别
    Medium Current

    上次验证: 4 天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    148348


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    APPLIED MATERIALS (AMAT) / VARIAN VIISta 900-3D

    APPLIED MATERIALS (AMAT) / VARIAN

    VIISta 900-3D

    Medium Current
    年份: 0状况: 二手
    上次验证4 天前

    APPLIED MATERIALS (AMAT) / VARIAN

    VIISta 900-3D

    verified-listing-icon
    已验证
    类别
    Medium Current
    上次验证: 4 天前
    listing-photo-19f14392127247ec9e9892935d9eb0b9-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    148348


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The Varian VIISta 900 3D system is the industry’s flagship medium-current ion implanter for high-volume manufacturing beyond the 2xnm node. Its beam-line architecture has been specially designed with the angle accuracy and beam shape control necessary for exact dopant placement and minimal within-wafer and wafer-to-wafer variability for applications in logic finFETs and 3D memory structures. These capabilities also benefit CMOS image sensor technology as well as the most advanced planar structures.
    文件

    无文件

    类似上架物品
    查看全部
    APPLIED MATERIALS (AMAT) / VARIAN VIISta 900-3D

    APPLIED MATERIALS (AMAT) / VARIAN

    VIISta 900-3D

    Medium Current年份: 0状况: 二手上次验证:4 天前
    APPLIED MATERIALS (AMAT) / VARIAN VIISta 900-3D

    APPLIED MATERIALS (AMAT) / VARIAN

    VIISta 900-3D

    Medium Current年份: 0状况: 二手上次验证:4 天前
    APPLIED MATERIALS (AMAT) / VARIAN VIISta 900-3D

    APPLIED MATERIALS (AMAT) / VARIAN

    VIISta 900-3D

    Medium Current年份: 0状况: 二手上次验证:19 天前