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说明
无说明配置
Manual Loading / up to an 8" round substrate x 1.2" deep. (9.5" x 9.5" x 1") Typical Capacity: Can accommodate die or special devices through manual loading Chamber is 4",6",8" compatible Up to three (3) 8" wafers with a special holder Up to three (3) 6" wafers with a special holder (Heated) (0-10torr) Fully Integrated Inductively Coupled Downstream Plasma Source for surface modification and cleaning Includes Gate Valve Isolation of Plasma Source Electronic Mass Flow Controller for Plasma Source gas control - Oxygen 13.56MHzOEM 型号描述
Molecular Vapor Deposition System文件
无文件
类别
MVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
101796
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SPTS / APPLIED MICROSTRUCTURES
MVD 100
类别
MVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
101796
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Manual Loading / up to an 8" round substrate x 1.2" deep. (9.5" x 9.5" x 1") Typical Capacity: Can accommodate die or special devices through manual loading Chamber is 4",6",8" compatible Up to three (3) 8" wafers with a special holder Up to three (3) 6" wafers with a special holder (Heated) (0-10torr) Fully Integrated Inductively Coupled Downstream Plasma Source for surface modification and cleaning Includes Gate Valve Isolation of Plasma Source Electronic Mass Flow Controller for Plasma Source gas control - Oxygen 13.56MHzOEM 型号描述
Molecular Vapor Deposition System文件
无文件