说明
No missing, No HDD配置
无配置OEM 型号描述
The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.文件
无文件
BESI / FICO
AMS-W40-306
已验证
类别
Packaging
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
57373
晶圆尺寸：
未知
年份：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / FICO
AMS-W40-306
类别
Packaging
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
57373
晶圆尺寸：
未知
年份：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
No missing, No HDD配置
无配置OEM 型号描述
The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.文件
无文件