说明
无说明配置
Chip-to-Substrate Thermo-Compression BonderOEM 型号描述
Advanced packaging, flip chip thermo-compression bonding applications.文件
无文件
KULICKE & SOFFA (K&S)
APAMA C2S
已验证
类别
Packaging
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
62829
晶圆尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KULICKE & SOFFA (K&S)
APAMA C2S
类别
Packaging
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
62829
晶圆尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Chip-to-Substrate Thermo-Compression BonderOEM 型号描述
Advanced packaging, flip chip thermo-compression bonding applications.文件
无文件