说明
De-Taping L*W*H (cm) -120x130x160 �Weight (kg) -� 1000 1. No Ecim function 2. Cannot support 12" wafer RFID Display is not included配置
无配置OEM 型号描述
The HR-8500-II is a fully automatic type that can handle wafers up to 8". Equipped with a robot arm for wafer transfer and a CCD type non-contact aligner for wafer alignment, transferring wafers without generating dust. Easy operation is possible with a touch panel. Transfers large diameter wafers without generating dust. An ultraviolet irradiation device can be installed as an option文件
无文件
类别
Packaging
上次验证： 9 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
143429
晶圆尺寸：
未知
年份：
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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NITTO
HR 8500 II
类别
Packaging
上次验证： 9 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
143429
晶圆尺寸：
未知
年份：
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
De-Taping L*W*H (cm) -120x130x160 �Weight (kg) -� 1000 1. No Ecim function 2. Cannot support 12" wafer RFID Display is not included配置
无配置OEM 型号描述
The HR-8500-II is a fully automatic type that can handle wafers up to 8". Equipped with a robot arm for wafer transfer and a CCD type non-contact aligner for wafer alignment, transferring wafers without generating dust. Easy operation is possible with a touch panel. Transfers large diameter wafers without generating dust. An ultraviolet irradiation device can be installed as an option文件
无文件