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说明
Oxford PlasmaLab 80 Plus PECVD配置
-Process: PECVD -Voltage: 208 VAC, 3 Phase -Equipment component: Main body Main power Pump X 2 ComputerOEM 型号描述
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.文件
无文件
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
75620
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 80 PLUS
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
75620
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Oxford PlasmaLab 80 Plus PECVD配置
-Process: PECVD -Voltage: 208 VAC, 3 Phase -Equipment component: Main body Main power Pump X 2 ComputerOEM 型号描述
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.文件
无文件