说明
P12XLn+ working condition配置
- Single Loader with FOUP Opener (Wide/Right Loader) - Flip SACC - Hot Chuck Top (Ni Hot Chuck 50-150C) - GPIB Interface - STD WAPP - OCR Insight - PCB SIO 4 Port - Shiva Bridge - CPU Board VIP4OEM 型号描述
The P-12XLn+ is a next-generation wafer prober developed for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad sizes. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn+'s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. The P-12XLn+ also features an automation system and equipment standardization, as well as clean technology, PC-aided product file management, and remote operation. It is capable of handling CIM/FA, such as AMHS, and is software compatible with the P-8 series probers. The P-12XLn+ is capable of measuring wafer sizes of 300mm, 200mm, and 150mm (option). TEL has also introduced the P12XLm, an improved model of the P-12XLn+, with superior alignment capability.文件
无文件
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
74200
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
P-12XLn+
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
74200
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
P12XLn+ working condition配置
- Single Loader with FOUP Opener (Wide/Right Loader) - Flip SACC - Hot Chuck Top (Ni Hot Chuck 50-150C) - GPIB Interface - STD WAPP - OCR Insight - PCB SIO 4 Port - Shiva Bridge - CPU Board VIP4OEM 型号描述
The P-12XLn+ is a next-generation wafer prober developed for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad sizes. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn+'s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. The P-12XLn+ also features an automation system and equipment standardization, as well as clean technology, PC-aided product file management, and remote operation. It is capable of handling CIM/FA, such as AMHS, and is software compatible with the P-8 series probers. The P-12XLn+ is capable of measuring wafer sizes of 300mm, 200mm, and 150mm (option). TEL has also introduced the P12XLm, an improved model of the P-12XLn+, with superior alignment capability.文件
无文件