We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多
说明
无说明配置
无配置OEM 型号描述
The WDF DP is a unique device that offers the dual functionality of a wafer prober and a dicing frame handler. It is specifically designed for CSP/WLCSPs, one of the fastest growing markets in recent years. The WDF DP can handle both regular wafers and wafers/substrates on dicing frames, resulting in production efficiency improvement. Additionally, the WDF DP helps reduce testing costs because of its change-over-kit less solution and higher index time as compared with a conventional handler. Some of its key features include wafer and dicing frame handling capability without use of a change-over-kit, over twice the throughput of conventional horizontally moving handler, special alignment available for diced wafers, hot temperature testing (max : 150℃), and flat-top for the large test-head. Overall, the WDF DP is an innovative solution that can help improve production efficiency and reduce testing costs.文件
无文件
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
11898
晶圆尺寸：
8"/200mm
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
WDF DP
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
11898
晶圆尺寸：
8"/200mm
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The WDF DP is a unique device that offers the dual functionality of a wafer prober and a dicing frame handler. It is specifically designed for CSP/WLCSPs, one of the fastest growing markets in recent years. The WDF DP can handle both regular wafers and wafers/substrates on dicing frames, resulting in production efficiency improvement. Additionally, the WDF DP helps reduce testing costs because of its change-over-kit less solution and higher index time as compared with a conventional handler. Some of its key features include wafer and dicing frame handling capability without use of a change-over-kit, over twice the throughput of conventional horizontally moving handler, special alignment available for diced wafers, hot temperature testing (max : 150℃), and flat-top for the large test-head. Overall, the WDF DP is an innovative solution that can help improve production efficiency and reduce testing costs.文件
无文件