说明
无说明配置
无配置OEM 型号描述
The WDF DP is a unique device that offers the dual functionality of a wafer prober and a dicing frame handler. It is specifically designed for CSP/WLCSPs, one of the fastest growing markets in recent years. The WDF DP can handle both regular wafers and wafers/substrates on dicing frames, resulting in production efficiency improvement. Additionally, the WDF DP helps reduce testing costs because of its change-over-kit less solution and higher index time as compared with a conventional handler. Some of its key features include wafer and dicing frame handling capability without use of a change-over-kit, over twice the throughput of conventional horizontally moving handler, special alignment available for diced wafers, hot temperature testing (max : 150℃), and flat-top for the large test-head. Overall, the WDF DP is an innovative solution that can help improve production efficiency and reduce testing costs.文件
无文件
TEL / TOKYO ELECTRON
WDF DP
已验证
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
12887
晶圆尺寸：
8"/200mm
年份：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
WDF DP
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
12887
晶圆尺寸：
8"/200mm
年份：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The WDF DP is a unique device that offers the dual functionality of a wafer prober and a dicing frame handler. It is specifically designed for CSP/WLCSPs, one of the fastest growing markets in recent years. The WDF DP can handle both regular wafers and wafers/substrates on dicing frames, resulting in production efficiency improvement. Additionally, the WDF DP helps reduce testing costs because of its change-over-kit less solution and higher index time as compared with a conventional handler. Some of its key features include wafer and dicing frame handling capability without use of a change-over-kit, over twice the throughput of conventional horizontally moving handler, special alignment available for diced wafers, hot temperature testing (max : 150℃), and flat-top for the large test-head. Overall, the WDF DP is an innovative solution that can help improve production efficiency and reduce testing costs.文件
无文件