概述

The HRP-240 is an automated high-resolution surface metrology tool that provides long scan profilometry and high-resolution imaging for CMP and Etch applications. It has a new Dipping Mode™ capability for high aspect ratio depth monitoring and is reliable and easy to use for high-speed step height monitoring. It is the best solution for topographic metrology for wafer sizes up to 200 mm and can be configured as a basic profiler or a high-resolution, high aspect ratio instrument.