
说明
The Clusterline 200 systems offeredis equipped with 5 single process chambers each. They were used only for reactive sputtering of SiO2 layers on 150mm blank Si wafers. Both systems are still in a clean room and in working conditions. Further devices mounted on these tools are: two vacuum loadports each, wafer aligners, buffer stations for upto 5 wafers, OCR back side readers. Handler Type MX800. 5x Pulsed DC chambers with RF on Chuck配置
无配置OEM 型号描述
未提供文件
无文件
类别
PVD / Sputtering
上次验证: 30 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
136261
晶圆尺寸:
6"/150mm
年份:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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CLUSTERLINE 200
类别
PVD / Sputtering
上次验证: 30 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
136261
晶圆尺寸:
6"/150mm
年份:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
The Clusterline 200 systems offeredis equipped with 5 single process chambers each. They were used only for reactive sputtering of SiO2 layers on 150mm blank Si wafers. Both systems are still in a clean room and in working conditions. Further devices mounted on these tools are: two vacuum loadports each, wafer aligners, buffer stations for upto 5 wafers, OCR back side readers. Handler Type MX800. 5x Pulsed DC chambers with RF on Chuck配置
无配置OEM 型号描述
未提供文件
无文件