
说明
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.配置
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEM 型号描述
未提供文件
无文件
类别
PVD / Sputtering
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
Installed / Running
产品编号:
102898
晶圆尺寸:
6"/150mm, 8"/200mm
年份:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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CLUSTERLINE 200
类别
PVD / Sputtering
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
Installed / Running
产品编号:
102898
晶圆尺寸:
6"/150mm, 8"/200mm
年份:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.配置
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEM 型号描述
未提供文件
无文件