说明
A mask bonding system that transfers the wafer and mask to the sputtering device chamber L after bonding for film deposition processing.配置
Wafer: 8 inches, processed one by one Metal Mask: Φ230 mm × t100 μm Configuration: L chamber × 1 T chamber × 1 Etching chamber × 1 Sputtering chamber × 4 Transfer Chamber: Robot with 2 pick-up specifications Etching Chamber: Power supply antenna 1KW, Bias: 600W, Substrate electrode water-cooled electrostatic chuck Sputtering Chamber: 4 chambers, Cathode: Magnet rotary cathode (upper side), DC: 10KW, Substrate electrode: Water-cooled electrostatic chuckOEM 型号描述
未提供文件
无文件
ULVAC
SME-200J
已验证
类别
PVD / Sputtering
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
110833
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULVAC
SME-200J
类别
PVD / Sputtering
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
110833
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
A mask bonding system that transfers the wafer and mask to the sputtering device chamber L after bonding for film deposition processing.配置
Wafer: 8 inches, processed one by one Metal Mask: Φ230 mm × t100 μm Configuration: L chamber × 1 T chamber × 1 Etching chamber × 1 Sputtering chamber × 4 Transfer Chamber: Robot with 2 pick-up specifications Etching Chamber: Power supply antenna 1KW, Bias: 600W, Substrate electrode water-cooled electrostatic chuck Sputtering Chamber: 4 chambers, Cathode: Magnet rotary cathode (upper side), DC: 10KW, Substrate electrode: Water-cooled electrostatic chuckOEM 型号描述
未提供文件
无文件