说明
Spare Parts配置
无配置OEM 型号描述
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.文件
无文件
KLA / VISTEC / LEICA
LDS3300 C
已验证
类别
Reticle / Mask Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Parts Tool
运行状况:
未知
产品编号：
101281
晶圆尺寸：
2"/50mm
年份：
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / VISTEC / LEICA
LDS3300 C
类别
Reticle / Mask Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Parts Tool
运行状况:
未知
产品编号：
101281
晶圆尺寸：
2"/50mm
年份：
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Spare Parts配置
无配置OEM 型号描述
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.文件
无文件