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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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KLA / VISTEC / LEICA LDS3300 C
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.
    文件

    无文件

    KLA / VISTEC / LEICA

    LDS3300 C

    verified-listing-icon

    已验证

    类别
    Reticle / Mask Inspection

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    104175


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    KLA / VISTEC / LEICA LDS3300 C

    KLA / VISTEC / LEICA

    LDS3300 C

    Reticle / Mask Inspection
    年份: 0状况: 二手
    上次验证60 多天前

    KLA / VISTEC / LEICA

    LDS3300 C

    verified-listing-icon
    已验证
    类别
    Reticle / Mask Inspection
    上次验证: 60 多天前
    listing-photo-8eefc5c7475249de9960f54df088d1cf-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/8eefc5c7475249de9960f54df088d1cf/6f700de6df2d4cca952fe430fc98a9b3_1_mw.jpg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    104175


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.
    文件

    无文件

    类似上架物品
    查看全部
    KLA / VISTEC / LEICA LDS3300 C

    KLA / VISTEC / LEICA

    LDS3300 C

    Reticle / Mask Inspection年份: 0状况: 二手上次验证:60 多天前
    KLA / VISTEC / LEICA LDS3300 C

    KLA / VISTEC / LEICA

    LDS3300 C

    Reticle / Mask Inspection年份: 2023状况: 零件工具上次验证:60 多天前