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KLA / VISTEC / LEICA LDS3300 C
  • KLA / VISTEC / LEICA LDS3300 C
说明
无说明
配置
无配置
OEM 型号描述
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.
文件

无文件

PREFERRED
 
SELLER
类别
Reticle / Mask Inspection

上次验证: 60 多天前

Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

104175


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

KLA / VISTEC / LEICA

LDS3300 C

verified-listing-icon
已验证
类别
Reticle / Mask Inspection
上次验证: 60 多天前
listing-photo-8eefc5c7475249de9960f54df088d1cf-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/8eefc5c7475249de9960f54df088d1cf/6f700de6df2d4cca952fe430fc98a9b3_1_mw.jpg
Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

104175


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明
配置
无配置
OEM 型号描述
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.
文件

无文件