说明
无说明配置
80 Plus RIE Single Chamber RIE, non-load locked Ideal for R&D reactive ion etch applications System setup with universal quartz platen (with ability to place various size(s) of substrates) Up to 200mm wafer capable System PC, Keyboard, Mouse AE RF600A RF Generator Trivac D60AC Rough Pump (or equivalent) Alcatel ATP400 Turbo Pump Chiller Operations Manual and Documentation Fully Refurbished to excellent condition Gas Box Currently Configured for: - N2 - Ar - O2 - SF6 - CHF3 Oxford Refurbishment Process Consists of: Chamber disassembled for refurbishment. Chamber received full wet clean. Chamber o-rings and seals are replaced with brand new. All MFCs rebuilt and calibrated professionally. All corrosive gas lines replaced with brand new. All Non-corrosive gas lines purged. Vacuum pumps professionally rebuilt. Turbo pump professionally rebuilt. Chiller fully tested. All wiring/wire harnesses are checked, repaired or replaced if needed. All liquid and air lines, tubing and fittings checked and replaced if necessary. Major components disassembled for checkout, servicing, cleaning and lubricating. Parts are repaired or replaced as needed. Checkout of all electronic and mechanical parts. Machine covers are cleaned, polished or replaced as neededOEM 型号描述
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.文件
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OXFORD
PLASMALAB 80 PLUS
已验证
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
79133
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 80 PLUS
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
79133
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
80 Plus RIE Single Chamber RIE, non-load locked Ideal for R&D reactive ion etch applications System setup with universal quartz platen (with ability to place various size(s) of substrates) Up to 200mm wafer capable System PC, Keyboard, Mouse AE RF600A RF Generator Trivac D60AC Rough Pump (or equivalent) Alcatel ATP400 Turbo Pump Chiller Operations Manual and Documentation Fully Refurbished to excellent condition Gas Box Currently Configured for: - N2 - Ar - O2 - SF6 - CHF3 Oxford Refurbishment Process Consists of: Chamber disassembled for refurbishment. Chamber received full wet clean. Chamber o-rings and seals are replaced with brand new. All MFCs rebuilt and calibrated professionally. All corrosive gas lines replaced with brand new. All Non-corrosive gas lines purged. Vacuum pumps professionally rebuilt. Turbo pump professionally rebuilt. Chiller fully tested. All wiring/wire harnesses are checked, repaired or replaced if needed. All liquid and air lines, tubing and fittings checked and replaced if necessary. Major components disassembled for checkout, servicing, cleaning and lubricating. Parts are repaired or replaced as needed. Checkout of all electronic and mechanical parts. Machine covers are cleaned, polished or replaced as neededOEM 型号描述
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.文件
无文件