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说明
无说明配置
无配置OEM 型号描述
The Applied Vantage RadOx RTP, using its oxidation chemistry, cultivates a dense, top-tier oxide in minimal thermal budgets. This system surpasses scaling challenges for essential oxidation processes like memory gate oxide and ONO stack, among others. Ensuring tight thermal regulation and in-process supervision, RadOx provides industry-leading oxide quality in the Radiance chamber on the highly efficient Vantage platform. This platform, characterized by its compact design and plug-and-play installation, leverages a unique radical-based oxidation method and boasts an extendible, low-pressure capability for cutting-edge thermal processing.Proprietary radical-based oxidation process Tight thermal budget control and in-process monitoring Extendible, reduced-pressure capability for advanced device thermal processing High productivity, small footprint Vantage platform with plug-and-play install design文件
无文件
类别
RTP/RTA
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
124353
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
VANTAGE RADOX
类别
RTP/RTA
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
124353
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Applied Vantage RadOx RTP, using its oxidation chemistry, cultivates a dense, top-tier oxide in minimal thermal budgets. This system surpasses scaling challenges for essential oxidation processes like memory gate oxide and ONO stack, among others. Ensuring tight thermal regulation and in-process supervision, RadOx provides industry-leading oxide quality in the Radiance chamber on the highly efficient Vantage platform. This platform, characterized by its compact design and plug-and-play installation, leverages a unique radical-based oxidation method and boasts an extendible, low-pressure capability for cutting-edge thermal processing.Proprietary radical-based oxidation process Tight thermal budget control and in-process monitoring Extendible, reduced-pressure capability for advanced device thermal processing High productivity, small footprint Vantage platform with plug-and-play install design文件
无文件