说明

This Tool will not come with HDD

配置

Model: Vantage Radiance RadOx / RTP Process: RadOx Technology: TP Platform Type: 300MM VANTAGE 3.X Application: DENSIFICATION / REFLOW Wafer Size: 300MM (12 INCH) Wafer Shape: SNNF Position A: (V352) RadOx2 Position B: (V352) RadOx2 Chamber A Process: TOXIC RP Chamber B Process: TOXIC RP WIP Delivery Type: OHT WIP DELIVERY Wafer Pass Thru and Storage: DUAL 2 SLOT ACTIVE COOLDOWN STATION Remote Control System Capable: NO Docked E99 Reading Capability: YES Loadport Types: SELOP 7 Load Port Operator Interface: STANDARD 8 LIGHT Configurable Colored Lights: YES Ionizing Systems: NONE Air Intake Systems: TOP INTAKE E84 Carrier Handoff: UPPER E84 INTERFACE ENABLED OHT E84 PIO Sensors and Cables: UPPER E84 SENSORS AND CABLES E99 Carrier ID: TIRIS WITH RF Carrier ID Host Cntrl Intrfc: NO Operator Access Switch: YES LIGHT TOWERS: 4 COLOR CONFIGURABLE LIGHT TOWER Interface A Option: YES eDiagnostic Ready: YES eDiagnostics: NONE FI Hot Blade - U BLADE: NONE FI MEE BLADE: NONE Out The Back Connection Type: RP Out The Back Connection NH3: NO Out The Back Connection H2: YES Chamber Water Cooling Kits: TWO CHAMBER RP Integration Hardware: CHAMBER A and B Rear Light Tower: Standard RAGB System Software: CGA Vantage Skins: TWO CHAMBER TOXIC LL/Transfer Pump: iPUP Monitor 1: 17 IN FLAT PANEL WITH KEYBOARD ON STAND Monitor 2: REMOTE 17 IN FLAT PANEL ON STAND Monitor 1 Cables: 25FT WITH 16 FEET EFFECTIVE Monitor 2 Cables: 25FT WITH 16 FEET EFFECTIVE Heat Exchanger Type: NONE Heat Exchanger Quantity: ZERO RTP Abatement Unit: NONE SEMI F47: YES System Labels: ENGLISH ONLY Semi S2 compliance: YES RTP Chamber Type: RADIANCE RADOX 2 300MM Technology Option: OPEN LOOP TUNER MFC Type: STEC Core Anneal and RTO: YES Ammonia Anneal: NONE BPSG Anneal: NOT APPLICABLE Rotation Type: WRLD TOXIC Low Flow O2: 5 SLM High Flow O2: 50 SLM Oxygen Analyzer: YES H2: HIGH FLOW LOW FLOW AND SIDE INJECT Process N2 for Flammable MNFLD: NO Gas Pallet Type: TOXIC RP COMMON GAS PALLET MWBC Improvement Kit: Reflector plate with quartz cover to extend MWBC Chamber Integration Lines: RadOx 2 RP Pump cable: 81 Feet Base Ring: Radox2 base ring Line 1: N2 (N/O), 50 SLM Line 2: O2, 50 SLM Line 3: O2, 5 SLM Line 4: - Line 5: - Line 6: H2, 15 SLM - Side Inject High Flow Line 7: H2, 22 SLM - High Flow Line 8: H2, 2 SLM - Low Flow Line 9: - Line 10: N2 (P/P), 30 SLM Restrictor Line 11: He, 30 SLM Line 12: N2 (BP), 50 SLM Line 13: N2 (Maglev), 100 SLM RTP Chamber Type: RADIANCE RADOX 2 300MM Technology Option: OPEN LOOP TUNER MFC Type: STEC Core Anneal and RTO: YES Ammonia Anneal: NONE BPSG Anneal: NOT APPLICABLE Rotation Type: WRLD TOXIC Low Flow O2: 5 SLM High Flow O2: 50 SLM Oxygen Analyzer: Yes H2: HIGH FLOW LOW FLOW AND SIDE INJECT Process N2 for Flammable MNFLD: NO Gas Pallet Type: TOXIC RP COMMON GAS PALLET MWBC Improvement Kit: Reflector plate with quartz cover to extend MWBC Chamber Integration Lines: RadOx2 RP Pump cable: 81 Feet Base Ring: Radox2 base ring Line 1: N2 (N/O), 50 SLM Line 2: O2, 50 SLM Line 3: O2, 5 SLM Line 4: - Line 5: - Line 6: H2, 15 SLM - Side Inject High Flow Line 7: H2, 22 SLM - High Flow Line 8: H2, 2 SLM - Low Flow Line 9: - Line 10: N2 (P/P), 30 SLM Restrictor Line 11: He, 30 SLM Line 12: N2 (BP), 50 SLM Line 13: N2 (Maglev), 100 SLM

OEM 型号描述

The Applied Vantage RadOx RTP, using its oxidation chemistry, cultivates a dense, top-tier oxide in minimal thermal budgets. This system surpasses scaling challenges for essential oxidation processes like memory gate oxide and ONO stack, among others. Ensuring tight thermal regulation and in-process supervision, RadOx provides industry-leading oxide quality in the Radiance chamber on the highly efficient Vantage platform. This platform, characterized by its compact design and plug-and-play installation, leverages a unique radical-based oxidation method and boasts an extendible, low-pressure capability for cutting-edge thermal processing.Proprietary radical-based oxidation process Tight thermal budget control and in-process monitoring Extendible, reduced-pressure capability for advanced device thermal processing High productivity, small footprint Vantage platform with plug-and-play install design