说明
3(ch)配置
RTP*3OEM 型号描述
Radiance Centura has been ergonomically designed. Each chamber has its own gas panel and the gas panel has been relocated to its current position below the chamber to make it more accessible. Radiance Centura 300mm chamber is available for atmospheric pressure and reduced pressure processing. Rurming the Radiance chamber at reduced pressure is usefiil for systems that have a LPCVD and RTP chamber on the same mainframe because it saves the total production time by reducing the time spent pumping up and down the transfer chamber between wafers. Centura Radiance™ is a production proven process tool of record for the 0.13µm node in various wafer fabrication facilities across the world. Typical temperature – time performance in the Centura Radiance™ chamber.文件
无文件
类别
RTP/RTA
上次验证： 9 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
150649
晶圆尺寸：
未知
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA RADIANCE
类别
RTP/RTA
上次验证： 9 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
150649
晶圆尺寸：
未知
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
3(ch)配置
RTP*3OEM 型号描述
Radiance Centura has been ergonomically designed. Each chamber has its own gas panel and the gas panel has been relocated to its current position below the chamber to make it more accessible. Radiance Centura 300mm chamber is available for atmospheric pressure and reduced pressure processing. Rurming the Radiance chamber at reduced pressure is usefiil for systems that have a LPCVD and RTP chamber on the same mainframe because it saves the total production time by reducing the time spent pumping up and down the transfer chamber between wafers. Centura Radiance™ is a production proven process tool of record for the 0.13µm node in various wafer fabrication facilities across the world. Typical temperature – time performance in the Centura Radiance™ chamber.文件
无文件