说明
Microtome Wafer Cutter, Spindle speed: 40,000 rpm. Power: 3.5 kVA. Three-phase 200V. Weight: 500 kg.配置
无配置OEM 型号描述
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.文件
无文件
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DISCO
DAD321
类别
Scribing, Cutting, Dicing
上次验证： 2 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
140558
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Microtome Wafer Cutter, Spindle speed: 40,000 rpm. Power: 3.5 kVA. Three-phase 200V. Weight: 500 kg.配置
无配置OEM 型号描述
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.文件
无文件