说明
Microtome Cutter, only minor signs of use. No maintenance required. Equipped with a 1.8kW spindle capable of cutting wafers up to 250mm diameter. Supports processing of materials including optical communication V-grooves, glass, and printed circuit boards with high precision and stable performance.配置
无配置OEM 型号描述
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.文件
无文件
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DISCO
DAD3350
类别
Scribing, Cutting, Dicing
上次验证： 2 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
140559
晶圆尺寸：
未知
年份：
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Microtome Cutter, only minor signs of use. No maintenance required. Equipped with a 1.8kW spindle capable of cutting wafers up to 250mm diameter. Supports processing of materials including optical communication V-grooves, glass, and printed circuit boards with high precision and stable performance.配置
无配置OEM 型号描述
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.文件
无文件