说明
Wafer Dicing Saw配置
无配置OEM 型号描述
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.文件
无文件
DISCO
DAD3350
已验证
类别
Scribing, Cutting, Dicing
上次验证： 10 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
72605
晶圆尺寸：
8"/200mm
年份：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DAD3350
类别
Scribing, Cutting, Dicing
上次验证： 10 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
72605
晶圆尺寸：
8"/200mm
年份：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Dicing Saw配置
无配置OEM 型号描述
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.文件
无文件