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Process: Wafer Dicing Mode: Fully-autoOEM 型号描述
The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.文件
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DISCO
DAD3360
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116465
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
2017
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说明
无说明配置
Process: Wafer Dicing Mode: Fully-autoOEM 型号描述
The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.文件
无文件