说明
无说明配置
Process: Wafer Dicing Mode: Semi-autoOEM 型号描述
2009 Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw. Ultra compact dual-spindle automatic dicing saw Small footprint The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafers文件
无文件
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DISCO
DAD3650
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116464
晶圆尺寸：
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Process: Wafer Dicing Mode: Semi-autoOEM 型号描述
2009 Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw. Ultra compact dual-spindle automatic dicing saw Small footprint The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafers文件
无文件