说明
Fully automatic wafer dicing saw for up to 8-inch wafers. Single spindle configuration, 1.0 kW spindle. Laser specifications and laser hours: N/A. Cutting material: Not specified.配置
无配置OEM 型号描述
DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."文件
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DISCO
DAD641
类别
Scribing, Cutting, Dicing
上次验证： 9 天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled
产品编号：
153663
晶圆尺寸：
未知
年份：
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Fully automatic wafer dicing saw for up to 8-inch wafers. Single spindle configuration, 1.0 kW spindle. Laser specifications and laser hours: N/A. Cutting material: Not specified.配置
无配置OEM 型号描述
DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."文件
无文件