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Wafer Saw配置
300mm Fully Automatic Dicing Saw Includes: 1.2 KW Facing dual-spindle Touch panel LCD CE-Mark and EMC Conformity Standard Accessories Tape Frame (DFT2-12 Type - Frame thickness 1.5mm) Cassette (DTC212 Type 300mm 13-slot standard cassette) Spare Porous Chuck table for 200mm Spare Spinner Table for 200mm Spinner Atomizing Nozzle Type HC2 (High Clean Version 2 Type) Non-Contact Setup Lifting Jig Set Power Cable Transformer specification (AC380 to 415V) 7m Transformer Unit Uninterruptible Power Supply CO2 Injector (internal Type) Stayclean Injector Kerf Center Alignment EMO Guard Ring Stylus Pen Magnet Fixing type Water Temperature Control Unit DTU1550 Includes: Power cable 7m Piping Assy Digital Flowmeter for chiller Status Indicator EMO Guard RingOEM 型号描述
The DFD6362 is a fully automatic dicing saw made by Disco Corporation. It is designed for improved productivity with Φ300 mm wafers and has a facing dual spindle. It offers higher dual cut processing speed due to the shortened distance between the spindles and various new functions.文件
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DISCO
DFD6362
类别
Scribing, Cutting, Dicing
上次验证： 29 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
101429
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available