说明
Wafer Dicing Saw配置
无配置OEM 型号描述
The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.文件
无文件
DISCO
DFD6363
已验证
类别
Scribing, Cutting, Dicing
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116265
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFD6363
类别
Scribing, Cutting, Dicing
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116265
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Dicing Saw配置
无配置OEM 型号描述
The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.文件
无文件