说明
无说明配置
Process: Wafer Dicing Mode: Fully-autoOEM 型号描述
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.文件
无文件
DISCO
DFD641
已验证
类别
Scribing, Cutting, Dicing
上次验证： 4 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116468
晶圆尺寸：
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份：
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFD641
类别
Scribing, Cutting, Dicing
上次验证： 4 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116468
晶圆尺寸：
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份：
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Process: Wafer Dicing Mode: Fully-autoOEM 型号描述
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.文件
无文件