We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多
说明
无说明配置
Process: Wafer Dicing Mode: Fully-autoOEM 型号描述
Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation文件
无文件
DISCO
DFD6450
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116470
晶圆尺寸：
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份：
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Process: Wafer Dicing Mode: Fully-autoOEM 型号描述
Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation文件
无文件