说明
无说明配置
Process: Wafer Dicing Mode: Fully-autoOEM 型号描述
Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation文件
无文件
DISCO
DFD6450
已验证
类别
Scribing, Cutting, Dicing
上次验证: 30 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
116470
晶圆尺寸:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFD6450
类别
Scribing, Cutting, Dicing
上次验证: 30 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
116470
晶圆尺寸:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Process: Wafer Dicing Mode: Fully-autoOEM 型号描述
Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation文件
无文件