说明
DISCO DFD650 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD650 MFG No.: EP131 Manufacturing Date: October 1996 Spindle Configuration: Dual Spindle Maximum Spindle Speed: 60,000 rpm Power Supply: AC 200V, 3-phase Power Capacity: 4 kVA Air Pressure: 0.5 MPa Air Consumption: 350 NL/min N2 Pressure: 0.5 MPa N2 Consumption: 200 NL/min Cutting Water Pressure: 0.3 MPa Cutting Water Flow: 14 L/min Cooling Water Pressure: 0.2 MPa Cooling Water Flow: 3 L/min Machine Weight: 1,300 kg Fully automatic dicing saw for semiconductor wafer processing. Equipped with dual spindles and automatic wafer handling.配置
无配置OEM 型号描述
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DISCO
DFD650
类别
Scribing, Cutting, Dicing
上次验证： 8 天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled
产品编号：
153628
晶圆尺寸：
未知
年份：
1996
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
DISCO DFD650 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD650 MFG No.: EP131 Manufacturing Date: October 1996 Spindle Configuration: Dual Spindle Maximum Spindle Speed: 60,000 rpm Power Supply: AC 200V, 3-phase Power Capacity: 4 kVA Air Pressure: 0.5 MPa Air Consumption: 350 NL/min N2 Pressure: 0.5 MPa N2 Consumption: 200 NL/min Cutting Water Pressure: 0.3 MPa Cutting Water Flow: 14 L/min Cooling Water Pressure: 0.2 MPa Cooling Water Flow: 3 L/min Machine Weight: 1,300 kg Fully automatic dicing saw for semiconductor wafer processing. Equipped with dual spindles and automatic wafer handling.配置
无配置OEM 型号描述
未提供文件
无文件