说明
Wafer Saw配置
无配置OEM 型号描述
Disco DFD681 can handle a workpiece size of up to ø8” wafer and has a 2.2 kW Synchro SpindleTM air bearing spindle. The maximum blade size is 76.2 mm and it has a single spindle configuration. It also has enhanced productivity with automatic alignment and can be used for applications such as cutting Quartz, glass, ceramics, Lithium Niobate, Lithium Tantalate and other hard-to-cut materials.文件
无文件
DISCO
DFD681
已验证
类别
Scribing, Cutting, Dicing
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
110342
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
DISCO
DFD681
类别
Scribing, Cutting, Dicing
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
110342
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Saw配置
无配置OEM 型号描述
Disco DFD681 can handle a workpiece size of up to ø8” wafer and has a 2.2 kW Synchro SpindleTM air bearing spindle. The maximum blade size is 76.2 mm and it has a single spindle configuration. It also has enhanced productivity with automatic alignment and can be used for applications such as cutting Quartz, glass, ceramics, Lithium Niobate, Lithium Tantalate and other hard-to-cut materials.文件
无文件