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说明
无说明配置
(with J5 laser head) LED process. The tool is used for dicingOEM 型号描述
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm Stealth Dicing™ SDBG SDTT DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones. Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping. This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.文件
无文件
DISCO
DFL7341
类别
Scribing, Cutting, Dicing
上次验证： 25 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
130658
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
(with J5 laser head) LED process. The tool is used for dicingOEM 型号描述
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm Stealth Dicing™ SDBG SDTT DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones. Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping. This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.文件
无文件