说明
Laser saw Die separator DFL7362 is DISCO laser saw(Not back grinder), and it is with DDS2300, wafer sorter in turn key.配置
Chuck/table size (Has 12 inch spec now) - Usage : Laser Diode - 1306.60 Hrs. Laser Head - 19082.40 Hrs. - Laser Source Type : SD06 typeOEM 型号描述
2017 Developed DFL7362, a stealth dicing laser saw that achieves higher throughput. Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si Φ300 mm Stealth Dicing™ SDBG SDTT DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers. Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength. The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.文件
DISCO
DFL7362
类别
Scribing, Cutting, Dicing
上次验证： 5 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
128847
晶圆尺寸：
12"/300mm
年份：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available