说明
Horizontal furnaces, GIGA TECH cleaning machines, and BAKE are excluded.配置
无配置OEM 型号描述
The MERCURY® MP Surface Conditioning System is a wet-chemical batch processing tool for wafers up to 200 mm in diameter. It offers reliable and repeatable processing for a variety of applications, with the flexibility and control to ensure superior performance and high yields. The system can be fully automated with the addition of an optional material handling system. The MERCURY MP system uses FSI centrifugal spray technology, which provides several advantages, including reduced chemical, DI water, and disposal costs, as well as a smaller footprint than typical wet processing systems. Etching applications that can be performed in the MERCURY system include patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.文件
无文件
类别
Spray Solvent / Acid
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
124677
晶圆尺寸：
6"/150mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / FSI
MERCURY MP
类别
Spray Solvent / Acid
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
124677
晶圆尺寸：
6"/150mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Horizontal furnaces, GIGA TECH cleaning machines, and BAKE are excluded.配置
无配置OEM 型号描述
The MERCURY® MP Surface Conditioning System is a wet-chemical batch processing tool for wafers up to 200 mm in diameter. It offers reliable and repeatable processing for a variety of applications, with the flexibility and control to ensure superior performance and high yields. The system can be fully automated with the addition of an optional material handling system. The MERCURY MP system uses FSI centrifugal spray technology, which provides several advantages, including reduced chemical, DI water, and disposal costs, as well as a smaller footprint than typical wet processing systems. Etching applications that can be performed in the MERCURY system include patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.文件
无文件