说明
-Dimension 1650x990x1700mm LxWxH配置
Semitool-SSTC421280M -Voltage 3x380V+N+PE -2 Hetated, 2 Unheated Tanks -280er Chamber for 25 Wafers 8“ -Tank 1,2 was used for EKC 265, Tank 3,4 for IPA -2x Fume Sensors -4x Electro Micropump PumpsOEM 型号描述
The Spray Solvent Tool (SST) is a compact, efficient system that enhances chemical reactions on wafer surfaces. It employs mechanical and centrifugal forces to achieve uniform coverage on both sides of the wafer. The closed loop process control ensures consistent results, while continuous recycling and filtration of chemicals reduce waste. The SST offers precise temperature control and flexibility in chemical delivery methods. With its high throughput, small footprint, and operator safety features, it provides reliable and low-maintenance operation. The tool supports various processes, including GaAs clean, metal lift-off, photoresist removal, post-etch residue removal, and thin film heads. It utilizes technologies such as copper RDL and pillar structures. Flexibility - featuring two, four, or seven tank configuration in small footprint cabinet; process chambers, product carriers, and quick-disconnect rotors are available for wafers up to 200mm文件
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SEMITOOL
SST 421
类别
Spray Solvent / Acid
上次验证： 20 天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
150348
晶圆尺寸：
8"/200mm
年份：
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
-Dimension 1650x990x1700mm LxWxH配置
Semitool-SSTC421280M -Voltage 3x380V+N+PE -2 Hetated, 2 Unheated Tanks -280er Chamber for 25 Wafers 8“ -Tank 1,2 was used for EKC 265, Tank 3,4 for IPA -2x Fume Sensors -4x Electro Micropump PumpsOEM 型号描述
The Spray Solvent Tool (SST) is a compact, efficient system that enhances chemical reactions on wafer surfaces. It employs mechanical and centrifugal forces to achieve uniform coverage on both sides of the wafer. The closed loop process control ensures consistent results, while continuous recycling and filtration of chemicals reduce waste. The SST offers precise temperature control and flexibility in chemical delivery methods. With its high throughput, small footprint, and operator safety features, it provides reliable and low-maintenance operation. The tool supports various processes, including GaAs clean, metal lift-off, photoresist removal, post-etch residue removal, and thin film heads. It utilizes technologies such as copper RDL and pillar structures. Flexibility - featuring two, four, or seven tank configuration in small footprint cabinet; process chambers, product carriers, and quick-disconnect rotors are available for wafers up to 200mm文件
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