说明
无说明配置
CHA Industries Mark 50 Isolated Source E-Beam Evaporator System 120-208V, 60Hz CTI Cryogenics Cryo-Torr 400 cryopump 2ea Granville-Phillips 307 vacuum gauge controllers Inficon IC6 deposition controller Telemark ST/SX controller Telemax 135-0700-1 programmable sweep controller Beam gun rotation controller Deposition controller Shutter controller Fixture controller Auto ion gun controller Heater power supply Trillium 2200 cryopump controller Cryocoil controller CHA HVPS-T-18373 / Telemark SX-10 power supply, 208V, 60Hz Busch BA 0100 A dry vacuum pump CTI Cryogenics 9600 compressor Domes for both 6" and 8" substrates.OEM 型号描述
The CHA Mark 50 is an industry-standard high vacuum deposition system known for its simplicity, ease of operation, and unmatched reliability, making it an excellent choice for a wide range of applications. The system features a horizontal 32" by 32" water-cooled cylindrical chamber, facilitating easy loading and unloading. Its unique slide-down front door minimizes floor space requirements, and a rear door provides convenient access to the chamber from behind, allowing for through-the-wall mounting. The Mark 50 is SECS/GEM and CE compliant, ensuring compatibility with modern manufacturing standards. It offers dual operation capabilities for sputtering and evaporation, accommodates moving substrates, and provides exceptional film uniformity (fixture dependent). The system supports up to 4 process stations with round cathodes (RF or DC) and co-deposition capability. Additionally, it includes bias (RF or DC), substrate heating up to 400°C with multi-element options, electron beam, thermal deposition, ion beam pre-clean/etch, and plasma texturing/etch functionalities. -Dual Operation, Sputtering and Evaporation -Moving substrates -Exceptional Film Uniformity (Fixture Dependent) -Sputter Up -Process Stations -Round Cathodes, RF or DC (Up to 4 Stations) -Co-deposit -Bias, RF or DC -Substrate heating, 400°C, multi-element -Substrate heating, station -Electron beam -Thermal -Ion beam pre-clean/etch -Plasma texturing/etch文件
无文件
CHA
MARK 50
已验证
类别
Thermal Evaporators
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
110945
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
CHA
MARK 50
类别
Thermal Evaporators
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
110945
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
CHA Industries Mark 50 Isolated Source E-Beam Evaporator System 120-208V, 60Hz CTI Cryogenics Cryo-Torr 400 cryopump 2ea Granville-Phillips 307 vacuum gauge controllers Inficon IC6 deposition controller Telemark ST/SX controller Telemax 135-0700-1 programmable sweep controller Beam gun rotation controller Deposition controller Shutter controller Fixture controller Auto ion gun controller Heater power supply Trillium 2200 cryopump controller Cryocoil controller CHA HVPS-T-18373 / Telemark SX-10 power supply, 208V, 60Hz Busch BA 0100 A dry vacuum pump CTI Cryogenics 9600 compressor Domes for both 6" and 8" substrates.OEM 型号描述
The CHA Mark 50 is an industry-standard high vacuum deposition system known for its simplicity, ease of operation, and unmatched reliability, making it an excellent choice for a wide range of applications. The system features a horizontal 32" by 32" water-cooled cylindrical chamber, facilitating easy loading and unloading. Its unique slide-down front door minimizes floor space requirements, and a rear door provides convenient access to the chamber from behind, allowing for through-the-wall mounting. The Mark 50 is SECS/GEM and CE compliant, ensuring compatibility with modern manufacturing standards. It offers dual operation capabilities for sputtering and evaporation, accommodates moving substrates, and provides exceptional film uniformity (fixture dependent). The system supports up to 4 process stations with round cathodes (RF or DC) and co-deposition capability. Additionally, it includes bias (RF or DC), substrate heating up to 400°C with multi-element options, electron beam, thermal deposition, ion beam pre-clean/etch, and plasma texturing/etch functionalities. -Dual Operation, Sputtering and Evaporation -Moving substrates -Exceptional Film Uniformity (Fixture Dependent) -Sputter Up -Process Stations -Round Cathodes, RF or DC (Up to 4 Stations) -Co-deposit -Bias, RF or DC -Substrate heating, 400°C, multi-element -Substrate heating, station -Electron beam -Thermal -Ion beam pre-clean/etch -Plasma texturing/etch文件
无文件