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说明
Tool does have TSV. Tool doesn’t have a TTV (total thickness variation) function.配置
Vacuum wafer chuck for 150mm and 200mm wafer CWL spectrometer 4kHz CWL 600µm sensor CWL FT (10µm) sensor head MHU (wafer handing unit) for 150mm and 200mm Semi standard wafer Prealigner Acquire Automation XT software packages: Film thickness; Step height; Bumps measurement (height, coplanarity, diameter); Roughness;OEM 型号描述
未提供文件
无文件
类别
Thin Film / Film Thickness
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
111618
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FORM FACTOR / CASCADE MICROTECH / FRT
MICROPROF 200
类别
Thin Film / Film Thickness
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
111618
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Tool does have TSV. Tool doesn’t have a TTV (total thickness variation) function.配置
Vacuum wafer chuck for 150mm and 200mm wafer CWL spectrometer 4kHz CWL 600µm sensor CWL FT (10µm) sensor head MHU (wafer handing unit) for 150mm and 200mm Semi standard wafer Prealigner Acquire Automation XT software packages: Film thickness; Step height; Bumps measurement (height, coplanarity, diameter); Roughness;OEM 型号描述
未提供文件
无文件